| abstract |
A polishing pad which performs a planarization processing of a material requiring high surface flatness such as a silicon wafer, a magnetic disk and an optical lens for a semiconductor at a stable and high polishing rate. Providing easy to produce surface processing such as sheeting and groove, etc., excellent thickness accuracy, high polishing speed, and providing a polishing pad with a uniform polishing speed, no variation in quality due to individual differences, and a change in processing pattern. Abrasive pads can be made easily, and fine processing is possible, and abrasive grains can be mixed at high concentrations in a slurry pad-less slurry that does not generate burrs when forming irregularities. Even if it disperse | distributes, the polishing pad with little scratch generation by abrasive particle aggregation is provided. The polishing layer is formed of a curable composition cured by an edge line, and the polishing layer is a polishing pad having irregularities on the surface formed by a photolithography method. It is set as the polishing pad whose polishing layer resin in which the abrasive grains were disperse | distributed is resin which has an ionic group of 20-1500 eq / ton. |