| abstract |
The present invention provides a novel insulating material having high thermal conductivity and high light reflectivity, and furthermore, as a submount for mounting an LED element, which can increase the effective utilization rate of light and dissipate heat generated from the element quickly. This provides a high submount. For example, a laminate having a base substrate having heat resistance and a layer made of a nitride sintered body formed on the base substrate, wherein the nitride sintered body has a thermal conductivity of 50 (W / m · K) or more and is 350 nm to 800 nm. The volume fraction of the voids in the entire sintered body has a reflectance with respect to light in the wavelength region of 50% or more and a reflectance for light with a wavelength of 700 nm or more and 60% or more and a diameter of 0.1 µm or more at the grain boundary. 10 to 70% of the laminate is provided.n n n n Nitride Sintered Body, Submount |