http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20090011952-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_1a492183be65153abfa7dec00d51c816 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13009 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-06181 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-488 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-043 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-043 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-488 |
| filingDate | 2007-07-27^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b9603828a7d4779a8a0d96aec2266cc5 |
| publicationDate | 2009-02-02^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-20090011952-A |
| titleOfInvention | Semiconductor package and manufacturing method thereof |
| abstract | A semiconductor package and a method of manufacturing the same are disclosed. The semiconductor package includes a semiconductor chip body having a bonding pad formed on a first surface, a first electrode formed in a first recess disposed on the first surface, and facing the first surface and electrically connected to the bonding pad. And a semiconductor chip formed in a second recess disposed on a second surface and having a second electrode connected to the first electrode. On both sides of the semiconductor chip, a first electrode including a high melting point metal and a second electrode connected to the first electrode and forming a low melting point metal are formed, respectively, thereby preventing damage to the first and second electrodes and the semiconductor chip. As a result, the time required for forming the first and second electrodes may be shortened, and the bonding force between the semiconductor chips may be greatly improved in a state in which at least two semiconductor chips are stacked. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8329579-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I501350-B http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-102388450-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2010120448-A3 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8062975-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2010120448-A2 |
| priorityDate | 2007-07-27^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
| Predicate | Subject |
|---|---|
| isDiscussedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID23978 http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID418354341 |
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