| abstract |
Provided is a semiconductor chip module having a high degree of freedom in assigning a circuit to each semiconductor chip and in the position of a connection terminal for each semiconductor chip.n n n BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor chip module in which a plurality of semiconductor chips, in which a portion of a connection terminal to be connected to a circuit pattern provided on a surface, is provided on a side surface, are bonded to each other. Terminal portions for connection on the side surfaces of each semiconductor chip are interconnected by a wiring pattern. The terminal for a connection in a semiconductor chip extends from the surface to the side surface, and is formed by spraying an electrically conductive material in the mist state. |