http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20100047849-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_6b822ee046eb6c45d1e3bd9ce9c1782e |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L29-66772 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L29-045 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76254 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-1266 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-1214 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L27-12 |
| filingDate | 2008-06-18^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_90a374176e49b6949d98fca23538a820 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a953d20a16a0e03217c79b4ae7b92a42 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7dec4d1ff9bbf4d655bc09a747cbae06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_75c6267d8c775da162e94c833c3742ac |
| publicationDate | 2010-05-10^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-20100047849-A |
| titleOfInvention | Method for manufacturing semiconductor device |
| abstract | This invention provides the manufacturing method of the semiconductor device by which the space | interval between the semiconductor films which are transposed to several places is suppressed. Translocation of the semiconductor film from the bond substrate to the base substrate is performed a plurality of times. In the case where the semiconductor film to be transferred first and the semiconductor film to be transferred later are adjacent to each other, the subsequent transfer is performed by using a bond substrate with an end portion partially removed. The bond substrate used for the subsequent transposition is assumed to be larger than the film thickness of the semiconductor film whose width in the direction perpendicular to the bond substrate in the region where the end portion is removed is first displaced. |
| priorityDate | 2007-06-28^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
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