| abstract |
The present invention provides a semiconductor chip capable of reducing noise generated when the guard ring and the through silicon via are spaced apart, and a stacked package using the same. The semiconductor chip of the present invention includes a silicon substrate; A first conductive guard ring and a second conductive guard ring formed by ion implantation of impurities spaced apart from each other by a predetermined interval in the silicon substrate; A first through silicon via penetrating the first conductive guard ring and the silicon substrate; And a second through silicon via penetrating the second conductive guard ring and the silicon substrate. The present invention described above forms a through silicon via to penetrate the guard ring formed by ion implantation. It is possible to isolate the noise generated by, and also to protect the through silicon vias from the noise present in the silicon substrate.n n n n Package, Through Silicon Via, Guard Ring, Ion Implantation, Noise, Semiconductor Chip |