| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_e757fd4fedc4fe825bb81b1b466a0947 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-3737
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-373 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-373
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-18 |
| filingDate |
2010-01-22^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b9edcf6f95245306feaf167e3319c1f7
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4b0453a1098e86ff4a5e107c79fb4cbe
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_564ef6a98464ca09cc7c982e19100e55
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_acb164370857845f149a7b8c76577baa
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_058f12104f526180c12d3f5d491dd890 |
| publicationDate |
2011-10-04^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-20110107853-A |
| titleOfInvention |
Low compression, non-silicone, high thermal conductivity formulations and packages for thermal interface materials |
| abstract |
An improved thermal interface material for semiconductor devices is provided. More specifically, low compression, non-silicone, high thermal conductivity formulations for thermal interface materials are provided. The thermal interface material includes a composition exhibiting a thermal conductivity of about 5.5 W / mK or more and a compressed bond line thickness of about 100 microns or less using a compressive force of about 100 psi or less. |
| priorityDate |
2009-01-22^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |