| abstract |
The present invention relates to a pressure-sensitive adhesive film for semiconductor wafer backgrinding, comprising a pressure-sensitive adhesive layer applied on one or both surfaces of a base film and bonded to a semiconductor wafer, wherein the pressure-sensitive adhesive layer has a weight average molecular weight of 1,200,000 to 3,000,000 Copolymers; A second acrylic copolymer having a weight average molecular weight in the range of 500,000 to 1,000,000; And a curing agent, wherein the second acrylic copolymer is formed from a thermosetting pressure-sensitive adhesive composition containing 5 to 20 parts by weight with respect to 100 parts by weight of the first acrylic copolymer. do. In the present invention, when grinding a semiconductor wafer, the wafer and the surface protective film for protecting the circuit wiring of the wafer are not damaged, and the cutting property and the adhesion are excellent, and the peeling property, the re-peeling property and the excellent water resistance are excellent. Wetting can be exhibited. |