| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b2bed4b4d247d7fe14cfd9610d22c463 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01R2201-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05B2203-016
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01R4-028
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01R2201-26
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01R13-03 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C22C38-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K35-264
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05B3-84
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C22C13-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C22C12-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B15-018
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01R4-028
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C22C38-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K35-262 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05B3-84
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H02G15-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K31-02 |
| filingDate |
2011-02-15^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_de6a4baf38ab02b05ecdea39784736e6
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_742135577d06c60a4dd301c134aeabce
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_96e94022510edfd6eb68c048e69a3b66
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_42d006a829da349a79f6f832c46b016c |
| publicationDate |
2013-04-04^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-20130034004-A |
| titleOfInvention |
Plate glass with electrical connection elements |
| abstract |
The present invention is directed to a substrate 1 made of glass having a first coefficient of thermal expansion, an electrically conductive structure 2 having a layer thickness of 5 μm to 40 μm on an area of the substrate 1, and a second coefficient of thermal expansion. Connecting element 3 having a difference between the first coefficient of thermal expansion and the second coefficient of thermal expansion less than 5 × 10 −6 / ° C .; and the connecting element 3 being electrically connected to a subregion of the electrically conductive structure 2. The layer of solder material 4 connected by means of the solder material 4 (layer thickness t exceeding 50 μm) is formed between the electrically conductive structure 2 and the connection element 3 as compared to the contact surface of the connection element 3. Outflow from the intermediate region with an outflow width (b) of less than 1 mm]. |
| priorityDate |
2010-03-02^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |