| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_20d3042eb4ea7c9afd525aa89373349d |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G2261-598
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G2261-3424
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G2261-76
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G2261-592
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G2261-135
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L65-00 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-621
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-62
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L61-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G8-36
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G8-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L63-00 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-62
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G8-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 |
| filingDate |
2011-09-27^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_084df0f3d81c046a430db7c0038bafe2
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_45206fa9221726350813a38c0c8b2dec
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a40e60cd6ee22a270998f88d439773fc
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4281dc619e35902a12f44a577f96ad3a |
| publicationDate |
2013-10-29^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-20130118289-A |
| titleOfInvention |
Curable resin composition, its hardened | cured material, a phenol resin, an epoxy resin, and a semiconductor sealing material |
| abstract |
It combines high moisture resistance and solder resistance with halogen-free and high flame resistance for environmental protection. Naphthyl methyloxy group or anthyl methyloxy group containing aromatic hydrocarbon group (ph1), phenolic hydroxyl group containing aromatic hydrocarbon group (ph2), and following General formula (1) (Wherein Ar represents a phenylene group or a biphenylene group, R independently represents a hydrogen atom or a methyl group) and has each structural site of the bivalent aralkyl group (X) represented by the said, and said naphthyl methyl jade A plurality of aromatic hydrocarbon groups selected from the group consisting of a period or anthrylmethyloxy group-containing aromatic hydrocarbon group (ph1) and the phenolic hydroxyl group-containing aromatic hydrocarbon (ph2) are interposed through the divalent aralkyl group (X). A phenol resin having a bonded structure is used as a curing agent for epoxy resins. |
| priorityDate |
2010-09-29^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |