| titleOfInvention |
Resin composition, resin sheet, resin sheet hardened | cured material, resin sheet laminated body, resin sheet laminated body hardened | cured material, its manufacturing method, a semiconductor device, and an LED device |
| abstract |
The present invention comprises a novolak resin containing an epoxy resin monomer, a compound having a structural unit represented by the following general formula (I), and a filler, wherein the filler has a particle diameter distribution measured using a laser diffraction method. , The filler having peaks in the respective ranges of 0.01 µm or more and less than 1 µm, 1 µm or more and less than 10 µm, and 10 µm or more and 100 µm or less, wherein the filler having a particle diameter of 10 µm or more and 100 µm or less contains boron nitride particles. It provides a resin composition. In General Formula (I), R 1 represents an alkyl group, an aryl group, or an aralkyl group, and R 2 and R 3 Each independently represents a hydrogen atom, an alkyl group, an aryl group, or an aralkyl group, m represents a number from 0 to 2, and n represents a number from 1 to 7. |