http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20140078825-A
Outgoing Links
Predicate | Object |
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assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c3bf98aa6d4de2752f2f6fac638dc2cd |
classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002 |
classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-18 |
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-14 |
filingDate | 2012-12-18^^<http://www.w3.org/2001/XMLSchema#date> |
inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_234792aed488a3184cd233c4cd94bb06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_bffb88f88d48c77f03421eab160ffece http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_fcfd0a3a7200c374b5692e24cfe63b3b http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_74fbbc2842370f064645e570e4b567b4 |
publicationDate | 2014-06-26^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | KR-20140078825-A |
titleOfInvention | Interlayer insulation film using novel insulating material and ic packaging substrate using the same |
abstract | The present invention relates to an interlayer insulating film using a novel insulating material and a semiconductor package substrate using the same. The interlayer insulating film of the present invention is formed by coating a thermosetting liquid crystal polymer as a novel insulating material in a semi-cured state (B-stage) on a base film made of a liquid crystal polymer so that a filling layer is formed, The adhesion between the base film and the filling layer is improved by the similar liquid crystal polymer system, and thereby the formation of the conductive cathode filament is suppressed by the base film made of the liquid crystal polymer, and the dense curing network formation of the thermosetting liquid crystal polymer in the filling layer The dendrite formation and growth are suppressed. Thus, by using the interlayer insulating film of the present invention, a semiconductor package substrate improved in dimensional stability, heat resistance, and electrical reliability under fixed pressure can be manufactured. |
priorityDate | 2012-12-18^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
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