| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_268be9afa00cf55b5aa72b1612151ecb |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-13
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-12042
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2221-6834
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2221-68386
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2221-68381
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2221-68331
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2221-68363
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-6836
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2301-502 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-673
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J7-22
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J7-35
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-6835
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J5-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-304 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-304 |
| filingDate |
2013-03-01^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_dc858c749c9ec03da2eaecd53626e43b
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_41a4c349a9504fc151eb61aea309c99f
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a82727be6619dcb202dbadb0e44a8864
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a7f343bafb31fb269cc585c1a8032d58
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d87ffa416d3f351ebcd0fdaaf743c05b |
| publicationDate |
2014-09-23^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-20140112563-A |
| titleOfInvention |
Manufacturing method of semiconductor device |
| abstract |
A method for manufacturing a semiconductor device having a processing member, the method comprising the steps of: performing pattern exposure on an adhesive layer of an adhesive support having a substrate and an adhesive layer capable of increasing or decreasing adhesiveness by irradiation with an actinic ray or radiation, Bonding the first surface of the member to be treated to the adhesive layer of the adhesive support, and forming a second adhesive layer on the second surface different from the first surface of the member to be treated A step of applying a mechanical or chemical treatment to the treatment member to obtain a treatment member, and a step of separating the first side of the treatment member from the adhesive layer of the adhesive support. |
| priorityDate |
2012-03-02^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |