| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_6f932d94618d9b875e401457b33e9761 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G02F1-136295 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K13-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23F1-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G02F1-136286 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09K13-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-306
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G02F1-136
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23F1-18 |
| filingDate |
2013-03-28^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3d48a3d9b5a6eea63aad04901c534ee7
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9094351ab429c10ea501e9d7e0fae0cf
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_51864babcc644b14518a06f11c6734ba |
| publicationDate |
2014-10-13^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-20140119885-A |
| titleOfInvention |
Etching composition for copper-based metal layer and method of preparing metal line |
| abstract |
More particularly, the present invention relates to a copper-based metal film etchant composition comprising 0.5 to 20% by weight of persulfate, 0.1 to 5% by weight of an azole compound, 0.5 to 3% by weight of a copper salt, The present invention relates to a copper-based metal film etchant composition which selectively etches only a copper-based metal film and has a taper profile whose etched pattern is excellent in straightness, and a wiring forming method using the same. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-111876780-A |
| priorityDate |
2013-03-28^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |