| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b55c349b43c3ecba4977fd52cc8f8c67 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2467-006
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2421-006 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J11-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J133-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J7-40
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J9-00 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J7-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J9-00 |
| filingDate |
2014-04-18^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_81d5f788bb1f23bdbaeb74c8d074649a
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c6bc085edf716bfcae636c60e2d8a91b
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3440af9827a5f83cce0a496884f5dd52
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8d0d78451b823acf2a8bdd86538acdca |
| publicationDate |
2015-01-28^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-20150010564-A |
| titleOfInvention |
Heat-peelable pressure-sensitive adhesive tape and cutting method of electronic components |
| abstract |
It is an adhesive tape that can fix chips sufficiently even after cutting. It prevents chip scattering during cutting and improves the yield when chips are cut. (1) when the probe tack value of the thermally expansible pressure-sensitive adhesive layer is B o and the probe tack value after standing for one week under the 0 ° C condition of the thermally expansible pressure-sensitive adhesive layer is B ) Is not more than 19.0%. W = (B o -B) / B o x 100 (1) |
| priorityDate |
2013-07-19^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |