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filingDate 2013-09-12^^<http://www.w3.org/2001/XMLSchema#date>
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publicationDate 2015-03-20^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber KR-20150030554-A
titleOfInvention Ag alloy bonding wire and a semiconductor device comprising the same
abstract The present invention relates to a silver alloy bonding wire and a semiconductor device using the silver alloy bonding wire. More particularly, the present invention relates to a silver alloy bonding wire containing silver (Ag) as a main component and containing 3 ppm by weight to 10000 ppm by weight of iridium (Ir) &Lt; / RTI &gt; When the bonding wire of the present invention is used, it is possible to provide a bonding wire having excellent bonding property and processability and high reliability.
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priorityDate 2013-09-12^^<http://www.w3.org/2001/XMLSchema#date>
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