| abstract |
A power semiconductor package according to an embodiment of the present invention includes: a base substrate on which at least one first semiconductor element is mounted; A lead frame having one end connected to the base substrate and the other end protruding outward; A supporting frame formed on an upper surface of the first semiconductor element and having a first adjusting member protruding downward; And a mold part sealing the base substrate, the lead frame, and a part of the support frame, wherein at least one of the first semiconductor elements has a different step difference. |