| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_0ddb9f3656270bc5410be3679322fead |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0393
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-1105
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-31504
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0141
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0129 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-05
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0393
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B15-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B15-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0313
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-036
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-03
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-387 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03 |
| filingDate |
2008-12-03^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_353a456b18beb7339e18f3b811556604
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2265884f1d3f1887bd8f5a1d60cb2e47
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7e6190cc58869aa8800bde44f1a30f53
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d5cd85b939eb620d671735b4d0aad669 |
| publicationDate |
2016-02-05^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-20160014113-A |
| titleOfInvention |
Laminate, method for producing laminate, flexible printed circuit board, and method for manufacturing flexible printed circuit board |
| abstract |
An object of the present invention is to improve adhesion between a resin material and a plating layer and heat resistance of a moisture-absorbing solder in a laminate and a flexible printed wiring board obtained using the laminate. A) A resin material containing at least a polymer film / a platemaking layer containing at least a crystalline thermoplastic resin is plated to produce a laminate including at least a platemaking layer / plating layer containing a polymer film / at least crystalline thermoplastic resin And a plating step of heating the laminated body and a heating step of applying heat to the laminated body, wherein the step of heating the laminated body comprises a step of forming a laminated body including at least a platemaking layer / plating layer containing a polymer film / at least crystalline thermoplastic resin Thus, the above problems can be solved. |
| priorityDate |
2007-12-11^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |