| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_20d3042eb4ea7c9afd525aa89373349d |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0366
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L61-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-022 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G8-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L63-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0373
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0326
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-293
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-295
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C07D307-92
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C07D307-77
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-62
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-09 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C07D307-92
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-62
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G8-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C07D307-77
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 |
| filingDate |
2014-02-27^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3f4a4e497cd21df54d782548ce389362
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9c52d5bf537499184d6674663714d596 |
| publicationDate |
2016-03-09^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-20160026848-A |
| titleOfInvention |
Compound containing phenolic hydroxyl group, phenolic resin, curable composition, cured product thereof, semiconductor sealing material, and printed circuit board |
| abstract |
A phenolic hydroxyl group containing compound having excellent heat resistance and flame retardancy in a cured product, a phenol resin containing the phenolic resin, a cured composition and a cured product thereof, and a semiconductor encapsulating material are provided. Wherein the phenolic hydroxyl group-containing compound has a dinaphthofuran skeleton and both naphthylene skeletons have a hydroxyl group on the aromatic nucleus. |
| priorityDate |
2013-06-26^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |