| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_bce787970b69aeb08d159e7c101c9ed7 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K2103-42
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K2103-50
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K2103-172 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K26-40
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K26-402
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K26-0624
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-78
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-308
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-3081
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K26-364
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67207
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-3065
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67069 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K26-364
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K26-402
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-78
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-3065
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-308
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K26-0622
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-67
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K26-40 |
| filingDate |
2014-08-18^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ecb73e35036bd94df6f7f95bb1ea7c23
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f4383c472c840a51d612e9f10749cb62
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4c1abb4654607c7168977a6b8a758791
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4e40db5e946ab757811e932831edecb5
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d73fddeb26fc0eb13bbd594190fec5ec
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d2c29980f84a6916bc08c9b3f529827b |
| publicationDate |
2016-05-12^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-20160052609-A |
| titleOfInvention |
Wafer dicing method for improving die packaging quality |
| abstract |
In embodiments, a hybrid wafer or substrate dicing process involving an initial laser scribe and subsequent plasma etch is implemented to also remove the oxide layer from the metal bumps on the wafer while dicing. In one embodiment, a method includes forming a mask covering a plurality of ICs on a semiconductor wafer, wherein the plurality of ICs include metal bumps or pads having an oxide layer. The method includes patterning the mask using a laser scribing process to provide a patterned mask having gaps exposing regions of the semiconductor wafer between the ICs. The method includes plasma etching the semiconductor wafer through gaps in the patterned mask to singulate a plurality of ICs and remove the oxide layer from the metal bumps or pads. |
| priorityDate |
2013-08-30^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |