| abstract |
An object of the present invention is to provide a resin composition for a film which is excellent in insulating properties and heat resistance and can maintain the bonding strength even when filled with an insulating filler and in particular a resin composition for a film capable of maintaining the bonding strength even when a high- . (A) a polyether compound having at both terminals a phenyl group bonded with a specific vinyl group, (B) a thermoplastic elastomer, (C) a naphthalene type epoxy resin, (D) a curing agent, and Wherein the amount of the component (C) is 0.5 to 30.0 parts by mass based on 100 parts by mass of the total of the component (A), the component (B), the component (C) and the component (D). |