Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_781c429e4e20536916ff74dcbe1b5417 |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K2103-12 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G02B7-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G02B7-09 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-562 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K1-008 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-60 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K1-0016 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03B3-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K1-19 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03B13-36 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C22C9-00 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G02B7-09 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03B3-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K1-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D3-56 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D3-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D5-12 |
filingDate |
2015-12-30^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a65fc1ff2fcf833b92bb95bb451c5b32 |
publicationDate |
2016-07-19^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
KR-20160086274-A |
titleOfInvention |
Titanium-copper alloy having plating layer |
abstract |
[PROBLEMS] To provide titanium copper capable of increasing adhesion strength to solder. (1) A method of manufacturing a copper-clad laminate, comprising the steps of: (1) providing a base material containing 1.5 to 5.0% by mass of Ti and having a composition of copper and unavoidable impurities; ≪ / RTI > |
priorityDate |
2015-01-09^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |