http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20160086274-A

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filingDate 2015-12-30^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a65fc1ff2fcf833b92bb95bb451c5b32
publicationDate 2016-07-19^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber KR-20160086274-A
titleOfInvention Titanium-copper alloy having plating layer
abstract [PROBLEMS] To provide titanium copper capable of increasing adhesion strength to solder. (1) A method of manufacturing a copper-clad laminate, comprising the steps of: (1) providing a base material containing 1.5 to 5.0% by mass of Ti and having a composition of copper and unavoidable impurities; &Lt; / RTI &gt;
priorityDate 2015-01-09^^<http://www.w3.org/2001/XMLSchema#date>
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