| abstract |
The present invention relates to a semiconductor device, comprising: a substrate including a circuit region and first and second connection regions disposed on opposite sides of the circuit region, respectively; a logic circuit disposed in the circuit region; A logic structure including a lower insulating film and a memory structure on the logic structure, the logic circuit comprising a first page buffer disposed adjacent the first connection region, and a second page buffer disposed adjacent the second connection region, Wherein the memory structure includes bit lines extending to at least one of the first and second connection regions. |