| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c16d2144a81bfa32a665dca1e93c3d37 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0989
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-09745
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-181
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0376
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0373
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-15311
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16225
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-1105
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48227
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y02P70-50
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48091
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-09409 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-22
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4007
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-48
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0219
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-181
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-341
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-34
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-3452
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-183
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-111
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-11
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-0073
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-488 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-48
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-11 |
| filingDate |
2015-08-28^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_41e5a51be3b2cccb5da3cf7eb5e878aa
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_09b1d782f891e6d346295e7abfc689d9
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_75849a88da2219b122d77f8dcb406419 |
| publicationDate |
2017-03-08^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-20170025414-A |
| titleOfInvention |
Printed circuit board and semiconductor package including the same |
| abstract |
A printed circuit board includes: a base substrate having a chip mounting area on an upper surface thereof; A plurality of connection pad structures disposed in the chip mounting area; And an extension pattern disposed on the base substrate and spaced apart and extending from each of the two adjacent contact pad structures adjacent to each other between two adjacent contact pad structures of the plurality of contact pad structures, The upper surface of the connection pad structure is located on a level higher than the upper surface of the extended pattern. |
| priorityDate |
2015-08-28^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |