| abstract |
An LED lamp comprises a die substrate, the substrate comprising a semiconductor material formed thereon, an electrode for applying a bias across the semiconductor material to emit light therefrom, and an adhesive for bonding the die substrate to a support substrate, Wherein the adhesive is a polymerized siloxane polymer having a thermal conductivity greater than 0.1 watts per meter (0.1 W / (m · K)) and wherein the adhesive is not light absorbing, wherein the siloxane polymer is a polymer backbone Silicon and oxygen, as well as an aryl or alkyl group bonded thereto, wherein the adhesive further comprises particles having an average particle size of less than 100 microns. |