| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_aa26e66dbe22b2103d6ab987098fc011 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K2203-50
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K2201-40
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K2103-50
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K2203-56
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C03B33-04 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K26-364
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K26-402
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K26-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K26-40
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K26-0622
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C03B33-0222
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C03B33-091
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C03B33-0955
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C03B33-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K26-082 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K103-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K101-40 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K26-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K26-364
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C03B33-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K26-40
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C03B33-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K26-0622
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C03B33-09
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C03B33-095 |
| filingDate |
2017-07-11^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1dc00142ded984761f573250bfc39dc7 |
| publicationDate |
2017-07-25^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-20170085999-A |
| titleOfInvention |
Method of closed form release for brittle materials using burst ultrafast laser pulses |
| abstract |
A method for machining and releasing closed molds from a transparent brittle substrate includes using ultra-fast laser pulses to drill patterns of orifices in the substrate. The orifices are formed by photoacoustic compression and extend completely or partially within the transparent substrate. The scribed lines of orifices spaced apart from each other in the transparent substrate include a closed pattern in the substrate. A heat source is applied in the region around the scribed lines of orifices spaced apart from one another in the transparent substrate until the closed pattern is released from the transparent substrate. |
| priorityDate |
2013-11-19^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |