Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_89afae566b725ae78e20cf972d9bcdc7 |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2301-408 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2221-68327 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2205-102 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2203-326 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J7-0239 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J11-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J7-30 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J7-35 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J7-22 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J7-0203 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-6836 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J201-00 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J7-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J201-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J11-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-683 |
filingDate |
2017-08-07^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_eaf8739795bdf2e93563d762937aa2c3 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d986044d0f10544813c345d2954db4c3 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a94ad2454631c4e26d3471c10e56b9e3 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8dc2721dc8687dbbd3a5560e159ecc50 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c87d1be7f6575f575cdde51e7973f5cb |
publicationDate |
2017-08-21^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
KR-20170094782-A |
titleOfInvention |
Adhesive composition and adhesive film |
abstract |
The present invention provides an adhesive composition having a further improved softening temperature for bonding wafers. The present invention provides an adhesive composition comprising an adhesive resin and a filler as an adhesive composition for bonding a wafer. Also provided is an adhesive film comprising an adhesive layer containing the adhesive composition. |
priorityDate |
2010-07-26^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |