http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20170094782-A

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filingDate 2017-08-07^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_eaf8739795bdf2e93563d762937aa2c3
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publicationDate 2017-08-21^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber KR-20170094782-A
titleOfInvention Adhesive composition and adhesive film
abstract The present invention provides an adhesive composition having a further improved softening temperature for bonding wafers. The present invention provides an adhesive composition comprising an adhesive resin and a filler as an adhesive composition for bonding a wafer. Also provided is an adhesive film comprising an adhesive layer containing the adhesive composition.
priorityDate 2010-07-26^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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