| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_9dd5aaafab7f8b38c642af340df1fe74 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-04105
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-32225
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-568
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-19
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-96
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73259
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-92244
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73267
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-12105 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-481
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-525
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L25-0657
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L25-0655
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-3171
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-043 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-043
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-525
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L25-065
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-48 |
| filingDate |
2016-02-24^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_86b761417dfd5b2e6d0becb274e33106
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_da7ce4f289949f65ac0d709bba4cf02c
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4612621446fe951c70a82f3aa234dffb
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3abb7fe07ef920da26649b869e1f558c |
| publicationDate |
2017-09-01^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-20170099513-A |
| titleOfInvention |
Semiconductor package and method for manufacturing the same |
| abstract |
A semiconductor package and a manufacturing method thereof are disclosed. A method of manufacturing a semiconductor package according to an embodiment of the present invention includes the steps of: attaching a semiconductor chip to at least a partial area of a lower wiring circuit pattern formed on a base; Forming a passivation layer on the base to surround the semiconductor chip; Forming a lower wiring circuit pattern on the passivation layer and a wiring circuit pattern electrically connected to the semiconductor chip; And removing the base. |
| priorityDate |
2016-02-24^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |