Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_6fd5b121112799b5b466142e00f4fe8d |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2201-622 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2301-312 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-3415 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-686 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J9-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-4042 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J163-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J11-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J11-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J11-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L79-04 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J163-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J9-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J11-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J11-06 |
filingDate |
2016-08-08^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5d57e980d45d4ca2960ffc0883a240dd |
publicationDate |
2018-03-19^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
KR-20180029102-A |
titleOfInvention |
Anionic curing composition |
abstract |
The present invention provides compositions comprising die attach adhesives, coatings and underfill materials, which are useful in the field of electronic device packaging and composites. Specifically, the present invention provides an epoxy-maleimide composition which is a liquid which cures together upon addition of an anionic curing catalyst in the absence of any other curing catalyst and which has a very low melting point. |
isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-102188113-B1 |
priorityDate |
2015-08-08^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |