http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20190026472-A

Outgoing Links

Predicate Object
assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_fa80eed27901ac84139c7a7109c21e17
classificationCPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-0228
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02293
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-0257
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02447
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-02
filingDate 2017-09-05^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ae767db2f25ec906bce90e4cf8ddf046
publicationDate 2019-03-13^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber KR-20190026472-A
titleOfInvention Epitaxial wafer and method for fabricating the same
abstract An embodiment includes a substrate; A first layer disposed on the substrate; A buffer layer disposed on the first layer; And an epi layer disposed on the buffer layer, wherein the substrate, the first layer, the buffer layer, and the epi layer include silicon carbide and a dopant, wherein the first layer has a concentration of the dopant Wherein the concentration of the dopant in the first layer is smaller than the concentration of the dopant in the substrate, and the concentration of the dopant in the first- The minimum concentration of the dopant in the two layers is the same as the concentration of the dopant in the first layer, and the peak concentration of the dopant in the first-first layer is the same as the concentration of the dopant in the buffer layer.
priorityDate 2017-09-05^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

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http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20140137795-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20140055337-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2009295728-A
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