| abstract |
A flexible package according to an exemplary embodiment of the present disclosure includes a flexible substrate; At least one chip on the upper surface of the flexible substrate; A conductive member electrically connecting the at least one chip and the flexible substrate; A relaxation layer covering the side surface of the at least one chip; And a flexible encapsulant surrounding the flexible substrate and the at least one chip, wherein the elongation of the relief layer is greater than that of the flexible encapsulant. The flexible package according to an embodiment of the present disclosure improves deformability, and prevents damage when the flexible package is bent. |