| abstract |
The present invention relates to a heat dissipation pad for semiconductor equipment, comprising a silicone resin including a silicone gel and a silicone rubber, and a heat dissipation filler dispersed in the silicone resin to increase thermal conductivity, and the silicone gel 100 It is characterized in that it comprises 1 to 10 parts by weight of silicone rubber based on parts by weight. In particular, such a heat dissipation pad for semiconductor equipment may prevent the heat dissipation pad itself from being cut or cracked, thereby increasing the PM (preventive maintenance) of the semiconductor equipment. |