abstract |
A first electronic component 30A having a terminal pattern in which a plurality of terminals are radially parallel, and a second electronic component 30B having a terminal pattern corresponding to the terminal pattern 21A of the first electronic component 30A are anisotropically formed. In the manufacturing method of a connection structure for anisotropically conductive connection using a conductive film, (i) the effective connection area per terminal is 3000 μm 2 or more, and the conductive particles (1) in the anisotropic conductive film 10A The number density is set to be 2000 pieces/mm 2 or more and 20000 pieces/mm 2 or less, or (ii) as an anisotropic conductive film 10B, conductive particles are arranged in a lattice shape, and the arrangement pitch and arrangement direction are three conductive particles at each terminal. It is assumed to be trapped abnormally, or (iii) what has a multicircle region 25 as an anisotropic conductive film 10C is used. In the connection structure manufactured by this method, terminals in which conductive particles are not trapped are reduced or eliminated. |