Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_33c8130e8f8f12ebea8a5278b8797b56 |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05B3-28 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05B3-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-6831 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05B2203-017 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T29-49083 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05B3-28 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05B3-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05B3-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H02N13-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01C17-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05B3-0014 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-6831 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05B3-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67103 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-67 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05B3-28 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05B3-14 |
filingDate |
2013-07-02^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2cec766a979fee19b9324123914e69a8 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1679f50fb1513f1277bf6fa691695c0f http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_34363e332f3eacc61ce8b3ad7e927c69 |
publicationDate |
2015-08-14^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
MX-2015000004-A |
titleOfInvention |
COMPOSITE SUBSTRATE FOR STRATIFIED HEATERS. |
abstract |
A method for the formation of a heater assembly for use in semiconductor processing includes the thermal securing of a heater substrate to an application substrate; and the application of a stratified heater to the heater substrate after the heater substrate is secured to the application substrate. The application of the stratified heater includes the application of a first dielectric layer on the heater substrate, the application of a resistive heating layer on the first dielectric layer, and the application of a second dielectric layer on the resistive heating layer. The heater substrate defines a material that has a thermal expansion coefficient that equals a thermal expansion coefficient of at least one of the first dielectric layer and a thermal expansion coefficient of the resistive heating layer. |
priorityDate |
2012-07-03^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |