http://rdf.ncbi.nlm.nih.gov/pubchem/patent/MY-139649-A

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filingDate 2004-03-12^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f75f592f1412a38bfe254474aeba33e8
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publicationDate 2009-10-30^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber MY-139649-A
titleOfInvention Electronic component and method for forming external electrodes thereof
abstract AN EXTERNAL ELECTRODE OF AN ELECTRONIC COMPONENT IS OBTAINED BY SUBSEQUENTLY FORMING A PLURALITY OF COATING LAYERS ON A SURFACE OF A BASE LAYER (13). FIRST, A FIRST COPPER LAYER (14) IS FORMED ON THE SURFACE OF THE BASE LAYER (13) BY A STRIKE ELECTROPLATING METHOD AND THEN A SECOND COPPER LAYER (15) IS ELECTROPLATED ON A SURFACE OF THE FIRST COPPER LAYER (14). SUBSEQUENTLY, A NICKEL LAYER (16) IS ELECTROPLATED ON A SURFACE OF THE SECOND COPPER LAYER (15) AND, FINALLY, A SOLDER LAYER IS ELECTROPLATED ON A SURFACE OF THE NICKEL LAYER (16).
priorityDate 2003-03-11^^<http://www.w3.org/2001/XMLSchema#date>
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