http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-200302859-A

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filingDate 2003-01-30^^<http://www.w3.org/2001/XMLSchema#date>
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publicationDate 2003-08-16^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber TW-200302859-A
titleOfInvention Dispersion for chemical mechanical polishing
abstract Aqueous dispersion for the chemical mechanical polishing of oxidic surfaces, containing a powder of pyrogenically produced silicon dioxide doped with aluminium oxide by means of an aerosol, which is characterised in that the powder displays an aluminium oxide content of between 0.01 and 3 wt.%, preferably between 0.2 and 1.5 wt.%, relative to the total amount of powder, and an average particle diameter in the dispersion of a maximum of 0.1 μ m. The dispersion is produced by dispersing the silicon dioxide powder doped with aluminium oxide by means of an aerosol in an aqueous medium with an energy input of at least 200 kJ/m3. The dispersion is used in the chemical mechanical polishing of oxidic surfaces, preferably silicon dioxide.
priorityDate 2002-02-07^^<http://www.w3.org/2001/XMLSchema#date>
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