| abstract |
In a semiconductor device having a pad, a first conductor (1a) and a second conductor (1b) are arranged at a surface of the pad (1). The first conductor (1a) has hardness that is greater than that of the second conductor (1b) and not less than that of a probe stylus (11). The first conductor (1a) is arranged at the surface of the pad (1) such that the probe stylus (11) hits or rubs against the first conductor (1a) at least one time while the probe stylus (11) is in contact with and sliding on the surface of the pad. Thereby, a semiconductor device having a pad which eliminates the need for cleaning or polishing a probe stylus is provided. |