Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_069a92549123806a5d654dc036a676e9 http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_fdad00677b9268c26e005a9e03a7b9dd |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24B37-015 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-304 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24B55-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24B41-061 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B37-30 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B37-32 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B41-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B37-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B7-24 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B55-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-304 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B49-14 |
filingDate |
2003-12-26^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9f2e5b73c0034b7bbcacb11fadfb00e8 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_867f67bd175c66732daa5c7252c407cb http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8785d9d4416b23a8e8cdc6718b77412c http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_59803fc2a52c3489a288cbeb811f46e8 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8c2ef218a451a8934bcd774f5009ec50 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a133886303c03672456c1c6fe9520c39 |
publicationDate |
2004-09-01^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
TW-200416108-A |
titleOfInvention |
Substrate holding mechanism, substrate polishing apparatus and substrate polishing method |
abstract |
A substrate holding mechanism, a substrate polishing apparatus and a substrate polishing method have functions capable of minimizing the amount of heat generated during polishing of a substrate to be polished and of effectively cooling the substrate holding part of the substrate holding mechanism and also capable of effectively preventing the polishing solution and polishing dust from adhering to the outer peripheral portion of the substrate holding part and drying out thereon. The substrate holding mechanism (top ring 1 ) has a mounting flange (2), a support member (6), and a retainer ring (3). A substrate (W) to be polished is held on the lower side of the support member (6) surrounded by the retainer ring (3), and the substrate (W) is pressed against a polishing surface. The mounting flange (2) is provided with a flow passage (26) contiguous with at least the retainer ring (3). A temperature-controlled gas is supplied through the flow passage (26) to cool the mounting flange (2), the support member (6) and the retainer ring (3). The retainer ring (3) is provided with a plurality of through-holes (3a) communicating with the flow passage (26) to spray the gas flowing through the flow passage (26) onto the polishing surface of a polishing table. |
isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I404166-B http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I644760-B http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I563585-B |
priorityDate |
2002-12-27^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |