| abstract |
The present invention is to ensure the pitch to the chip edge, and eliminate the short circuit between the adjacent wire loopon the multi-layer wire loopof the laminated chips, and the wire has better elasticity without deformation. The present invention includes the following steps: connecting the wire 3 at the first bonding point A; slightly raising the capillary 5; next, conducting the first reversing operation; raising the capillary 5, and conducting the second reversing operation; raising the capillary 5, and conducting the third reversing operation; closing the fixture to horizontally move the capillary 5 toward the opposite direction of the second bonding point K; opening the fixture to horizontally move the capillary 5 toward the direction of the second bonding point K; and, raising the capillary 5 approximately above the first bonding point A and drawing the wire 3 to connect with the second bonding point K. |