| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_38ed56a4b4e8e2315b2b3308bffedb3f |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-321
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76829
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76838
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-7684
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76826
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76888 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-321
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-768 |
| filingDate |
2004-11-16^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_27d5e02520f3050ff3402fd7bc1a17f6
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f09ec633a973927697dff350db42bd16
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_acad4ae909676cc30968609bc74cb87d
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_de7142b22a63cb9ede423ecec0ee638b
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e58280734063e355ddbca26a38154bcd |
| publicationDate |
2005-08-01^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-200525633-A |
| titleOfInvention |
Multi-step plasma treatment method to improve cu interconnect electrical performance |
| abstract |
A method for plasma treating an exposed copper surface and dielectric insulating layer in a semiconductor device manufacturing process including providing a semiconductor wafer having a process surface including an exposed copper portion and an exposed dielectric insulating layer portion; plasma treating in a first plasma treatment process the process surface with a first plasma including ammonia (NH3) and nitrogen (N2) plasma to form a copper nitride layer overlying the exposed copper portion; and, plasma treating in a second plasma treatment process the process surface with a second plasma including oxygen (O2). |
| priorityDate |
2004-01-20^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |