Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_543ea12d23365cbbdcb0a3e056c87ccc |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-12556 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-121 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-12861 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0329 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-12514 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0257 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-12569 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-12535 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-12049 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-06 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-38 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-282 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-247 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-28 |
filingDate |
2007-08-27^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b46a6e29ccc838e79cf6a3402c489edc |
publicationDate |
2008-05-16^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
TW-200822825-A |
titleOfInvention |
Article with a coating of electrically conductive polymer and precious/semiprecious metal and process for production thereof |
abstract |
The invention relates to a coated article which has (i) at least one electrically non-conducting base layer, (ii) at least one layer of copper and/or a copper alloy, and (iii) a layer which contains at least one electrically conductive polymer, wherein the copper or copper alloy layer (ii) is positioned between the base layer (i) and the layer containing the conductive polymer (iii), and which is characterized in that the layer (iii) contains at least one precious metal or at least one semiprecious metal or a mixture thereof. The invention also relates to a process for its production and also its use for the prevention of corrosion and to preserve the solderability of printed circuit boards. |
priorityDate |
2006-09-13^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |