| abstract |
A stacked packaging module is disclosed, which comprises: a first packing structure comprising a first circuit board with a first chip embedded therein, wherein the first circuit board comprises a first surface, a opposite second surface, a plurality of exposed electro-connecting end, and a plurality of first conductive pads on the first surface, wherein at least one of the electrode pads of the first chip electro-connects to one electro-connecting end and one first conductive pad through the conductive vias and circuit layers within the first circuit board; and a second packing structure electro-connecting to the first packing structure through a plurality of solder balls to make package on package. The stacked packing module provided by this invention has characters of compact size, high performance, high flexibility, and detachability. |