http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-200938615-A

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filingDate 2008-11-07^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c2eedb60f621198606c0f114772522f8
publicationDate 2009-09-16^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber TW-200938615-A
titleOfInvention Compositions and methods for ruthenium and tantalum barrier CMP
abstract This invention provides a chemical-mechanical polishing composition comprising an abrasive, an aqueous carrier, an oxidizing agent having a standard reduction potential of greater than 0.7 V and less than 1.3 V relative to a standard hydrogen electrode, and optionally a source of borate anions, with the proviso that when the oxidizing agent comprises a peroxide other than perborate, perphosphate, or percarbonate, the chemical-mechanical polishing composition further comprises a source of borate anions, wherein the pH of the chemical-mechanical polishing composition is between 7 and 12. The invention also provides a method of polishing a substrate with the aforementioned chemical-mechanical polishing composition.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11482450-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-110957217-A
priorityDate 2007-11-09^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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