http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-201116174-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b1784eb7fc902d292db30e120ec712d5 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-098 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0338 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-09 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-06 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-09 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B15-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-06 |
| filingDate | 2010-06-18^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a7761381a400209ccdb9c7bf871b40e7 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_fd7299ce84ea43066dc1fb3ee7d4381b http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_410924f14baa8ab2374a63d4d30033b8 |
| publicationDate | 2011-05-01^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | TW-201116174-A |
| titleOfInvention | Electronic circuit, method for forming same, and copper-clad laminate for electronic circuit formation |
| abstract | Provided is an electronic circuit formed of copper circuits which have a layer (A) made of copper or a copper alloy, another layer (B) made of copper or a copper alloy, and still another layer (C), and which are formed by removing parts of the layer (A), the layer (B) and the layer (C) through an etching process. The layer (A) is formed on a surface in one side or surfaces in both sides of a resin substrate. The layer (B) is formed on a part or the entirety of the surface of the layer (A). The layer (C) is formed on a part or the entirety of the surface of the layer (B) and gives an etching rate slower than copper in etching with a copper etching solution. The electronic circuit is characterized in that spaces on the resin substrate, which are formed between the copper circuits, are adjusted so as to have a width according to a thickness of copper corresponding to a combination of the layer (A) and the layer (B). The electronic circuit addresses the possibility of forming circuits having uniform circuit widths, improvement of etching performance in pattern etching, and prevention of short-circuiting and occurrence of inadequate circuit widths. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I455659-B |
| priorityDate | 2009-06-18^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
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