| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b0120933550ea729b9f3186c3772531b |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0723
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-122
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-32
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0242
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0355
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0307
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-48
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-12549
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-12535
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-12792 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D1-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D7-0614
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-611
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-605
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-384
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D7-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B15-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D11-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-09
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B15-08 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D5-34
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D5-48
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D1-04 |
| filingDate |
2010-08-13^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_44147b8065582a977d33a0cb56bcdfb2
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9ca07c61789e44dbfb5e4d9cbce327ad |
| publicationDate |
2011-05-16^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-201116653-A |
| titleOfInvention |
Heat-resistant copper foil and method for producing same, circuit board, and copper-clad laminate board and method for manufacturing same |
| abstract |
Disclosed is a copper foil which has excellent high frequency characteristics and heat resistance, while achieving high heat-resistant adhesion to a resin substrate at the same time. Specifically disclosed is a heat-resistant copper foil which has a configuration wherein a primary roughened surface layer which has been subjected to a primary roughening process by copper metal, a secondary roughened surface layer which has been subjected to a secondary roughening process by copper metal, and a tertiary processed surface layer which has been subjected to a tertiary processing process by zinc metal are sequentially provided on one surface of an unprocessed copper foil. Also specifically disclosed are: a circuit board which is obtained by laminating the heat-resistant copper foil on a flexible resin substrate or a rigid resin substrate; and a method for manufacturing a copper-clad laminate board wherein the heat-resistant copper foil and a heat-resistant resin substrate are thermally pressure-bonded and the tertiary processed surface layer, which is composed of the roughened copper metal and the zinc metal, is alloyed. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I751251-B
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I646227-B
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11466379-B2 |
| priorityDate |
2009-08-14^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |