| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b0120933550ea729b9f3186c3772531b |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-6836 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-304
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J7-02 |
| filingDate |
2011-03-10^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3180b6a0c6324ae1b0a02b8e8a740b78
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_903f1fad8cfee0cbae0a68db7d95cf3f |
| publicationDate |
2012-01-16^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-201202382-A |
| titleOfInvention |
Wafer processing tape |
| abstract |
Provided is a wafer processing tape which has a uniform expansion property suitable for the step of splitting an adhesive layer by expansion, exhibits a sufficient contraction property in a heat contraction step, and causes no failure resulting from slack after the heat contraction step. As a base film 11 of the wafer processing tape 10 used when splitting the adhesive layer 13 along a chip by expansion, a thermoplastic crosslinking resin which has a Vicat softening point specified by JISK7206 being ≧50℃ and < 90℃ and an increase in stress caused by heat contraction being ≧9Mpa is used. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11676936-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I697539-B
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I743809-B
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I798419-B
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I699420-B
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I759375-B
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I755743-B
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I743810-B
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I743811-B
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I461498-B |
| priorityDate |
2010-03-31^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |