http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-201212112-A

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filingDate 2011-03-30^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_eaf8739795bdf2e93563d762937aa2c3
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publicationDate 2012-03-16^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber TW-201212112-A
titleOfInvention Separating method and separating agent
abstract In order to provide a stripping method for stripping a supporting plate from a substrate in a short time easily, a method according to the present invention is a method for stripping a wafer from a supporting plate to which the wafer is adhered via an adhesive agent, and which supporting plate has a through hole penetrating the supporting plate in a thickness direction of the supporting plate, and includes: dissolving the adhesive agent with a stripping solution, by contacting the stripping solution to the adhesive agent via the through hole. The adhesive agent has a hydrocarbon resin as a viscous component, and the stripping solution is a hydrocarbon-based solvent having a viscosity of 1.3 mPa.s or less and a dissolving rate of 30 nm/sec or greater to dissolve the adhesive agent.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10580640-B2
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