| abstract |
Providing a transfer substrate for forming metallic wiring on an object to be transferred through a transfer method, which is operable with a heating temperature of the object to be transferred side lowered, and a method for forming metallic wiring. The transfer substrate comprises a substrate, at least a metallic wiring material formed on the substrate, and an underlying metal film formed between the substrate and the metallic wiring material, and transfers the metallic wiring material to the object to be transferred. The metallic wiring material is a compact prepared by sintering gold pigment or the like having purity of 99.99% or more and an average particle size of 0.01 μ m to 1.0 μ m, and the underlying metal film is a transfer substrate comprises of such metals as gold or the like or alloys. The transfer substrate can transfer the metallic wiring material to the object to be transferred even when the heating temperature of the object to be transferred is set to 80-300 DEG C. |