| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_8e43b4ca6b41ce9f54c9a895d474c81a |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G77-80 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-42
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-296
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L83-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L63-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-306
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G77-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-56 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L33-56
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-40
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-20 |
| filingDate |
2012-09-27^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_17d4ce3be89dc5a04e1d175a9a828b92
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_946f5ff45d52d73074fd6c0d121cd2ea
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_62f934b55813afd9d7ff9045c979625a |
| publicationDate |
2013-06-16^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-201323469-A |
| titleOfInvention |
Curable resin composition for sealing optical semiconductor elements and cured product thereof |
| abstract |
The present invention provides a curable resin composition for sealing an optical semiconductor element which is excellent in heat cycle resistance. The curable resin composition for sealing an optical semiconductor element of the present invention is characterized in that the glass transition temperature (Tg) of the cured product measured by the DMA method is in the range of -10 to 10 ° C, and is measured by the DMA method at 0 ° C. The storage elastic modulus is in the range of 0 to 150 MPa, and preferably contains an epoxy resin (A) and an epoxy resin hardener, and the epoxy resin (A) is a polyoxyl skeleton epoxy resin. . |
| priorityDate |
2011-09-27^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |