| abstract |
The present invention provides a curable resin composition which can form an insulating adhesive layer having a sufficient bonding strength and having high thermal conductivity at low cost. The curable resin composition of the present invention is a curable resin composition containing aluminum nitride particles, an epoxy resin, a curing agent, and an acidic phosphate represented by the following general formula (1), and the above components are mixed with each other. Cheng, □ (in the formula (1), R1: hydrocarbon group having 4 to 20 carbon atoms, R2: saturated hydrocarbon group having 1 to 20 carbon atoms, R3: saturated hydrocarbon group having 2 to 3 carbon atoms, R4: carbon number 1~ 8 of the hydrocarbon group, k: 0~20, l: 0~20, m: 0~20, n: 1~2, when Ri(i: 1~4) is plural, the plural R4 may be the same Different, the order of k-COR2O- group, l-R3O- group and m-COR4COO- group is arbitrary, and when n=2, the two side chains may be the same or different). |